DG-Forming Solder
There is a proven track record of use in power devices represented by power modules, die bonding, semiconductor ICs, and encapsulants.
High-purity alloys with impurities removed as much as possible are used. The vacuum refining method (DG treatment) removes dissolved gases, which are one of the causes of voids (applicable only to lead-containing alloys). There are no surface contaminants, oils, oxides, or scratches, ensuring good wettability. For product inquiries, please visit our company website. http://www.nihonhanda.com For more details about the products, please refer to the information below.
- Company：ニホンハンダ
- Price：Other
